Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production.
Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there!
Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.
It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.
Some asked why advanced packaging tops our list of target applications; others wanted to hear more about our company and additional applications on our radar. So, our Multibeam Marketing Staffer (MMS) sat down with Chairman David Lam and President Ken MacWilliams (D&K) to address some of the questions that came our way.
Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!
Multibeam will be at the 2024 GOMAC conference and will be co-exhibiting in booth 509 with SkyWater Technology. Stop by to hear about the latest capabilities that our technologies are enabling in both defense and commercial spaces!
Multibeam will be presenting a paper at the IEEE ECTC conference in 2024 in collaboration with Deca Technologies, detailing the ways in which our technology capabilities are enabling the next generation of heterogeneous integration! We are abstract number #782.
Join us for a session on High-productivity maskless patterning at the deep submicron scale: An overview of Multibeam’s multicolumn e-beam lithography system at the 2024 SPIE Advanced Litho + Patterning conference. Join us on February 28, 2024 at 5:30 PM PST in the Convention Center, Hall 2!