Multibeam’s Cover & Article with Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System Advanced lithography technology to serve as a key enabler for SkyWater’s domestic foundry roadmap to 45 nm SANTA CLARA, CA|BLOOMINGTON, MN – November 18, 2020SkyWater Technology,the trusted technology realization partner, and Multibeam Corporation, the maskless lithography technology leader, today disclosed a partnership …
Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System $38 Million DoD Contract Awarded to Multibeam to Develop New MEBL Application SANTA CLARA, CA – September 10, 2020Multibeam Corporation todayconfirmed it has embarkedupon an ambitious project to apply its innovative Multicolumn E-Beam Lithography (MEBL) technology …
Security Lithography MARCH 3RD, 2020 – BY: MARK LAPEDUS At the recent SPIE Advanced Lithography conference, Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography for chip security applications. David Lam, chief executive and chairman of Multibeam, described how multi-beam lithography can be used to help thwart IC counterfeiting and tampering in …