World's First
High-Productivity Multicolumn E-Beam Lithography Platform
100X
100X
>100X
ZERO
Faster time to pattern
Depth of focus range
More designs per wafer
Masks
Enabling Innovative Chip Integration and Fabrication Capabilities for Next Generation Multi-Die Systems Photonics Quantum Technologies Optical Gratings DFB Lasers MEMS & Sensors Power Devices Rapid Prototyping
Multibeam partners with leading device makers to push the boundaries of what is possible in semiconductor design and manufacturing, with an overarching goal to accelerate chip innovation for a variety of rapidly growing technologies and applications.
Multibeam leads the multicolumn e-beam lithography market with a platform that enables rapid prototyping and production of leading-edge semiconductors with fastest time-to-market advantages for special applications like advanced packaging, fabrication of DFB laser gratings, compound semiconductors, MEMS & sensors, photonic ICs, and more.
Multibeam leads with a breakthrough Multicolumn E-Beam Lithography solution for cost-effective production of leading-edge semiconductors and rapid time to market.
Recent News & Events
Multibeam wins 2024 Gold Stevie® Award for Technology Excellence
- Jun 22, 2026
Multibeam to Present at 2026 Litho Workshop
Multibeam has been invited to present at the 2026 Litho Workshop in Sedona, AZ. Multibeam will present the latest updates on the MB platform, extended capabilities and applications it is positioned to bolster, and what’s next on the company’s product evolution roadmap.
- Apr 20, 2026
Multibeam to Present at Advanced Packaging (AP) International 2026
Multibeam has been invited to present at the 2026 AP International conference in the Heterogeneous Integration track. Multibeam president Ken MacWilliams will discuss how high-productivity multi-column EBL can enable the next generation of advanced integration.
- Dec 3, 2025
Multibeam Presents in Session 1 at PDF Solutions Users Group 2025
Multibeam was invited to present at the 2025 PDF Users Group Conference on the groundbreaking capabilities that the Multi-column EBL system is bringing to the advanced integration industry, and the role PDF Solutions technology plays in the inner workings of the system.
- Oct 8, 2025
Multibeam Partners with Marketech to Accelerate Sales of its Multi-column E-Beam Lithography (MEBL) Systems in Taiwan
Following the launch of its Japan sales operation earlier this year and with fresh funding from global investors, Multibeam is now moving to fulfill demand for its E-Beam Lithography (EBL) production systems from semiconductor leaders in Taiwan.
Read the full press release here: https://www.globenewswire.com/news-release/2025/10/08/3163416/0/en/Multibeam-Partners-with-Marketech-to-Accelerate-Sales-of-its-Multiple-Column-E-Beam-Lithography-EBL-Systems-in-Taiwan.html
- Sep 17, 2025
Multibeam Adds Industry Leaders to Board of Directors
Multibeam Corp. today announced that it has strengthened its global leadership bench by appointing three semiconductor industry executives to its Board of Directors. Elvino da Silveira, David J. Lam, and Amy Leong complete the Board that also includes Multibeam’s Chairman & CEO, David K. Lam and President, Ken MacWilliams.
Read the full press release here:
- Jul 29, 2025
Multibeam Secures $31 Million in Series B Funding
Multibeam Corp. announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc. (NYSE: ONTO), a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm of Lam Research Corp. (NASDAQ: LRCX), a global provider of wafer fabrication equipment and services for the semiconductor industry. Participants also include UMC Capital, the venture capital arm of UMC Corp. (NYSE: UMC), and MediaTek Capital, the venture capital arm of MediaTek Inc. (TWSE: 2454.TW). Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors.
Read the full press release here:
- Jul 7, 2025
Multibeam Presents at CHIPcon 2025
Multibeam presented at CHIPcon San Jose, 2025 to explore how MEBL can enable the next generation of advanced packaging
- Mar 18, 2024
Multibeam Presents Joint Paper with U of Arkansas at CS ManTech 2025
Multibeam collaborated with University of Arkansas’ Multi-User Silicon Carbide facility team to demonstrate the benefits of leveraging Multibeam lithography to pattern over non-planar SiC wafers compared to traditional optical lithography.
- Apr 17, 2025
Multibeam Announces Launch of Japan Sales Office
The development marks a new phase in Multibeam’s growth strategy. It follows the launch of the company’s multicolumn EBL production system and inaugural shipment to foundry leader, SkyWater Technology.
- Mar 18, 2024
Multibeam Presents at Synopsys SNUG Silicon Valley 2025
Multibeam will be presenting at Synopsys’ 2025 SNUG Silicon Valley event. Catch Multibeam President Ken MacWilliams’ presentation titled “Co-optimization of chips and packages enabling higher performance through Advanced Integration.”
- Dec 16, 2024
Multibeam’s 2024 Feature in Semiconductor Digest Magazine
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2025. Check out his Executive Viewpoint – “Exciting Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems,” – on page 56 of the November/December 2024 issue!
- Aug 7, 2024
Multibeam Corporation Honored as Gold Stevie® Award Winner in 2024 Stevie Awards for Technology Excellence
August 7, 2024 – Multibeam Corporation has been named the winner of a Gold Stevie® Award in the Manufacturing Technology category in the first annual Stevie Awards for Technology Excellence, “the Olympics for technology.”
The Stevie Awards for Technology Excellence celebrate the remarkable accomplishments of individuals, teams, and organizations shaping the future of technology across all industry sectors.
More than 600 nominations from organizations of all sizes in 21 nations and territories were submitted this year for consideration in a wide range of tech-related categories, including Company of the Year, Educational or Research Institution of the Year, Technical Innovation of the Year, Technology Breakthrough of the Year, and more in a variety of industry groupings including Advertising, Marketing, and PR, Aerospace Technology, Biotechnology, Business Technology, Healthcare Technology, among others. Multibeam is a winner in the Manufacturing Technology category for Technical Innovation of the Year.
Read more about the 2024 competition and view all the winning organizations here: www.StevieAwards.com/Tech
- Jul 25, 2024
SkyWater Announces Enhanced Capabilities with Multibeam’s First in Industry High Productivity Multicolumn E-Beam Lithography System
Positions SkyWater’s Minnesota fab with the most advanced 200 mm lithography offering in the world
- Jul 15, 2024
Multibeam’s Feature in Silicon Semiconductor
Multibeam President Ken MacWilliams sat down with Phil Alsop to talk about how Multibeam has transcended traditional EBL productivity barriers to produce the world’s first Multicolumn E-Beam Litho PRODUCTION system.
- Jun 27, 2024
Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
SkyWater Technology orders first system for rapid production of high-mix integrated circuits (ICs) and microdevices
- Jun 12, 2024
Multibeam’s 2024 Cover & Article Feature in Chip Scale Review magazine
Semiconductor Scaling with High-Productivity Multicolumn Electron Beam Lithography – Multibeam’s CEO David K. Lam and President Kenneth P. MacWilliams
- Apr 24, 2024
Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System
Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production.
Using electron beams to produce patterns on silicon wafers, e-beam lithography enables faster yield ramp since there is no need to wait for a mask to be manufactured. Additionally, more efficient cycles of learning are realized given the ability to pattern design iterations across a single wafer.
- May 1, 2024
MEMS & Sensors Technical Congress – MSTC 2024
Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there!
- Mar 19, 2024
Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024
Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.
It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.
The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) direct write solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. Multibeam makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth.
- Feb 6, 2024
Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards
Multibeam has been selected as a WINNER of the 2024 3D InCites Advanced Technology Enablement Awards! (Check out our “Finalist” feature on pg. 29 of the Yearbook)! We will be at IMAPS DPC in Arizona to accept the award – meet us there!
The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth.
Get in touch with our experts to explore how we can accelerate technology innovation, together.
Multibeam Corporation
1213 Innsbruck Drive
Sunnyvale, CA 94089, U.S.A.
