If you’re excited by innovation, impact, and contributing meaningful work to something truly transformative, this role is for you. Come build what’s next with us.  

In this role, you’ll help drive lithography process development and material evaluation for leading edge technologies and leverage your expertise to improve existing processes. Your work will enable breakthroughs  across various applications, including advanced packaging—pushing on‑package performance to approach on‑chip integration—and unlock on‑wafer stitching of die to overcome reticle and yield limits in conventional flows. 

About Multibeam 

Multibeam Corporation is a leading high productivity electron-beam technology innovator in wafer fab equipment. Our technology will revolutionize the industry with maskless, full-wafer patterning capabilities. Our multi-column direct write system pushes what is possible by enabling rapid prototyping to volume production with maskless lithography flexibility.  

We believe the key to our success are our people. Our best employees love what they do and bring unique backgrounds to our fast-paced, highly collaborative environment. We are managed by some of the brightest in Silicon Valley, including Dr. David K. Lam, founder and prior CEO of Lam Research. The ideal candidate is independent, flexible, and enjoys working in a fast-paced and creative technical environment. 

What you’ll do 

• Own hands-on lithography from resist spin to develop and metrology, turning experiments into stable process 

• Plan and run smart DoE campaigns that separate signal from noise and accelerate learning 

• Triage and resolve issues across hardware, process, and metrology—fast 

• Partner with cross-functional teams (process, applications, systems, product) to move from demo to production 

What you’ll bring 

• Hands-on lithography experience (photo or e-beam), from tool setup to recipe  

• Strong resist processing fundamentals (materials, bake/develop windows, line edge/linewidth control) 

• Proven lithography process troubleshooting skills (root cause, containment, corrective actions) 

• Experiment planning / DoE skills and a data‑driven approach to decisions 

Why this is exciting 

• Help build and scale groundbreaking, first-of-its-kind technology that’s redefining the industry 

• Enable the emergence of new microfabrication segments, such as quantum computing, next generation advanced packaging and high-speed photonics 

• Support the development of packaging technologies that bridge the gap between on-chip performance and overall device performance 

• Advance on-wafer stitching of die to break past reticle and traditional yield constraints 

• Enable novel quantum and photonics solutions 

• Ship real capability—measurable performance and productivity with real world impact