Multicolumn E-Beam Lithography
"THE PAST IS PROLOGUE TO THE FUTURE"
Personal Note from our Founder Dr. David K. Lam
I am grateful for the opportunities to advance chip making technologies in the semiconductor industry. From founding Lam Research in 1980 to develop a single-wafer, cassette-to-cassette, digital-controlled plasma etch system — to now leading development of Multibeam’s MEBL platform to deliver a high-productivity, direct-writing maskless system using multiple miniature e-beam columns — I have never been more excited about revolutionizing the future of semiconductor
2024 SPIE Advanced Lithography+Patterning
Multibeam will present High-productivity maskless patterning at the deep submicron scale: An overview of Multibeam’s multicolumn e-beam lithography system at the 2024 SPIE Advanced Litho + Patterning conference. Join us on February 28, 2024 at 5:30 PM PST in the Convention Center, Hall 2!
SEMICON West 2024
Multibeam will be exhibiting at SEMICON West 2024 – find us at booth #5558!
Multibeam’s Cover & Article with Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – Multibeam’s CEO Dr. David K. Lam, and President Ken MacWilliams have published an article with Chip Scale Review
Lithography Workshop – Sun Valley
Multibeam President Ken MacWilliams will give a presentation on game-changing capabilities enabled by Multibeam technology on May 3, 2023, during session S10.
Multibeam’s Ken MacWilliams will give a presentation on “High-Productivity Direct Write E-beam Accelerates Early Concept Prototyping and High Mix Production of Trusted and Assured Microelectronics”
E-beam Initiative – Luncheon Speaker
Founder and CEO Dr. David Lam participated as an invited speaker at the E-Beam Initiative lunch and gave an update on Multibeam’s Multicolumn E-Beam Litho system. The presentation went into a discussion around вЂњCommon Misconceptions about E-Beam Lithography”.