Multi-column E-Beam Lithography Technology
Multibeam’s multicolumn platform combines miniature e-beam columns, parallel direct-write architecture, and integrated Synopsys CATS data prep for high-throughput, damage-free lithography — accelerating prototyping and production for advanced packaging, compound semiconductors, MEMS & sensors, photonics, and more.
100X
Faster time to pattern
100X
Depth of focus range
>100X
Depth of focus range
Zero
Masks
Miniature E-Beam Columns
Multibeam’s miniature column is a game changer
Revolutionary multicolumn architecture, solves the e-beam productivity challenge
5kV beam energy advantage: Higher speed without the intrinsic damage of 50-100kV systems
Multibeam's data preparation system leverages Synopsys CATS software
Synopsys CATS was custom modified for Multibeam, and is fully integrated into Multibeam system software.
Features:
Multibeam's data preparation system pairs physics-based and model-based corrections with broad format support, giving engineers a production-ready toolchain built for IC manufacturing from day one.
- Both physics-based and model-based corrections included (3D proximity effect, thermal, etc.)
- Designed for use in IC production; customer usability
- Handles GDSII, OASIS, MULTIGON formats
Benefits:
The result is a faster, simpler path from design to production — turning complex chip data into machine-ready instructions and shortening the loop between validation and ramp.
- Easier and faster path from chip design to production
- Easy transcription of complex chip design data into machine-readable instructions for e-beams
- Rapid iterations between design feedback and validation
- Fast ramp to production upon design validation
TECHNOLOGY
Parallel, Direct-Write
- Columns write independently and in parallel for maximum productivity
- High speed parallel data paths stream a torrent of writing information to each column
- Harmonized spot size, beam current, and precision patterning
Digital Writing System
- Multibeam's data processing system seamlessly converts GDSII / OASIS files for fully automated wafer patterning
- Direct-write capability offers tremendous flexibility
- Direct-write capability offers tremendous flexibility
TECHNOLOGY
Headquarter Office - Silicon Valley, U.S.A
Get in touch with one of our experts to explore how we can accelerate the next generation of technology, together.
Multibeam Corporation
+1 (408) 980-1800
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1213 Innsbruck Drive Sunnyvale, CA 94089, U.S.A.
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