Events

Find out about current and upcoming events.

Multibeam’s 2024 Cover & Article Feature in Chip Scale Review magazine

Jun 12, 2024

Semiconductor Scaling with High-Productivity Multicolumn Electron Beam Lithography – Multibeam’s CEO David K. Lam and President Kenneth P. MacWilliams

Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System

Apr 24, 2024

Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production. 

Using electron beams to produce patterns on silicon wafers, e-beam lithography enables faster yield ramp since there is no need to wait for a mask to be manufactured. Additionally, more efficient cycles of learning are realized given the ability to pattern design iterations across a single wafer.

MEMS & Sensors Technical Congress – MSTC 2024

May 1, 2024
Los Angeles, CA

Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there!

Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024

Mar 19, 2024

Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.

It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.

The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.

Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) direct write solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. Multibeam makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth.

Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards

Feb 6, 2024

Multibeam has been selected as a WINNER of the 2024 3D InCites Advanced Technology Enablement Awards! (Check out our “Finalist” feature on pg. 29 of the Yearbook)! We will be at IMAPS DPC in Arizona to accept the award – meet us there!

The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.

Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth.

Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards

Jan 8, 2024

Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! (Check out our feature on pg. 29 of the Yearbook)! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. We’re thrilled to be recognized by such an innovation-forward org for the work we’re doing in this space. Stay tuned!