Events
Find out about current and upcoming events.
Multibeam Secures $31 Million in Series B Funding
Multibeam Corp. announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc. (NYSE: ONTO), a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm of Lam Research Corp. (NASDAQ: LRCX), a global provider of wafer fabrication equipment and services for the semiconductor industry. Participants also include UMC Capital, the venture capital arm of UMC Corp. (NYSE: UMC), and MediaTek Capital, the venture capital arm of MediaTek Inc. (TWSE: 2454.TW). Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors.
Read the full press release here:
Multibeam Presents at CHIPcon 2025
Multibeam presented at CHIPcon San Jose, 2025 to explore how MEBL can enable the next generation of advanced packaging
Multibeam Presents Joint Paper with U of Arkansas at CS ManTech 2025
Multibeam collaborated with University of Arkansas’ Multi-User Silicon Carbide facility team to demonstrate the benefits of leveraging Multibeam lithography to pattern over non-planar SiC wafers compared to traditional optical lithography.
Multibeam Announces Launch of Japan Sales Office
The development marks a new phase in Multibeam’s growth strategy. It follows the launch of the company’s multicolumn EBL production system and inaugural shipment to foundry leader, SkyWater Technology.
Multibeam Presents at Synopsys SNUG Silicon Valley 2025
Multibeam will be presenting at Synopsys’ 2025 SNUG Silicon Valley event. Catch Multibeam President Ken MacWilliams’ presentation titled “Co-optimization of chips and packages enabling higher performance through Advanced Integration.”
Multibeam’s 2024 Feature in Semiconductor Digest Magazine
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2025. Check out his Executive Viewpoint – “Exciting Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems,” – on page 56 of the November/December 2024 issue!
Multibeam Corporation Honored as Gold Stevie® Award Winner in 2024 Stevie Awards for Technology Excellence
August 7, 2024 – Multibeam Corporation has been named the winner of a Gold Stevie® Award in the Manufacturing Technology category in the first annual Stevie Awards for Technology Excellence, “the Olympics for technology.”
The Stevie Awards for Technology Excellence celebrate the remarkable accomplishments of individuals, teams, and organizations shaping the future of technology across all industry sectors.
More than 600 nominations from organizations of all sizes in 21 nations and territories were submitted this year for consideration in a wide range of tech-related categories, including Company of the Year, Educational or Research Institution of the Year, Technical Innovation of the Year, Technology Breakthrough of the Year, and more in a variety of industry groupings including Advertising, Marketing, and PR, Aerospace Technology, Biotechnology, Business Technology, Healthcare Technology, among others. Multibeam is a winner in the Manufacturing Technology category for Technical Innovation of the Year.
Read more about the 2024 competition and view all the winning organizations here: www.StevieAwards.com/Tech
SkyWater Announces Enhanced Capabilities with Multibeam’s First in Industry High Productivity Multicolumn E-Beam Lithography System
Positions SkyWater’s Minnesota fab with the most advanced 200 mm lithography offering in the world
Multibeam’s Feature in Silicon Semiconductor
Multibeam President Ken MacWilliams sat down with Phil Alsop to talk about how Multibeam has transcended traditional EBL productivity barriers to produce the world’s first Multicolumn E-Beam Litho PRODUCTION system.
Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
SkyWater Technology orders first system for rapid production of high-mix integrated circuits (ICs) and microdevices