Multibeam’s Cover & Article with Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review
Events
Lithography Workshop – Sun Valley
Multibeam President Ken MacWilliams will give a presentation on game-changing capabilities enabled by Multibeam technology on May 3, 2023, during session S10.
GOMAC
Multibeam’s Ken MacWilliams will give a presentation on “High-Productivity Direct Write E-beam Accelerates Early Concept Prototyping and High Mix Production of Trusted and Assured Microelectronics”
E-beam Initiative – Luncheon Speaker
Founder and CEO Dr. David Lam participated as an invited speaker at the E-Beam Initiative lunch and gave an update on Multibeam’s Multicolumn E-Beam Litho system. The presentation went into a discussion around “Common Misconceptions about E-Beam Lithography”.
SPIE Adv Litho – Novel Patterning & E-Beam Initiative
Multibeam President, Ken MacWilliams presented “High-Productivity Direct Write E-Beam Lithography: An Enabling Patterning Technology to Augment Your Lithography Toolbox.” Founder and CEO Dr. David Lam also attended as an invited speaker at the E-Beam Initiative lunch.
BEST IN SESSION: ASCEND Space Conference
Multibeam President, Ken MacWilliams will be presenting “Enabling Next-Generation Space Systems with High Productivity Electron Beam Lithography”