Events

Multibeam was invited to present at CHIPcon, San Jose as part of their speaker series. The event explored new advancements in the semiconductor industry in categories like device/package architectural planning, packaging material & process technology selection, design & simulation, and device assembly & test. Multibeam President, Dr. Ken MacWilliams, gave a speech as part of Session 5: Advanced Packaging Materials & Process Technologies to show how MEBL can rediscover the classic benefits of Moore’s law. The event took place from July 7th through the 10th and while Ken’s presentation was on the 10th, Multibeam had the privilege of tabling throughout the event.

Multibeam collaborated with University of Arkansas’ Multi-User Silicon Carbide facility team to demonstrate the benefits of leveraging Multibeam lithography to pattern over non-planar SiC wafers compared to traditional optical lithography.

Multibeam will be at the 2024 GOMAC conference and will be co-exhibiting in booth 509 with SkyWater Technology. Stop by to hear about the latest capabilities that our technologies are enabling in both defense and commercial spaces!