February 2024

Chip Scale Review cover

Q&A with David & Ken

Some asked why advanced packaging tops our list of target applications; others wanted to hear more about our company and additional applications on our radar. So, our Multibeam Marketing Staffer (MMS) sat down with Chairman David Lam and President Ken MacWilliams (D&K) to address some of the questions that came our way.

Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards

Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.