Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there!