Multibeam was invited to deliver two presentations at the 2026 Semicon West conference in San Francisco.

Multibeam’s Ted Prescop presented in the Advanced Packaging & Heterogeneous Integration (APHI) session, and highlighted how Multibeam is accelerating innovation through its groundbreaking CHIPS Act project to develop next-generation fine-pitch process flows aimed at dramatically reducing chip-to-chip power consumption and unlocking new possibilities for multi-chip integrated systems.

Later in the week, Ken MacWilliams, President of Multibeam, presented in the Advanced Manufacturing session and explored how high-productivity direct-write lithography is helping semiconductor manufacturing keep pace with AI—enabling faster cycles of learning, greater customization, and new manufacturing freedom.