Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
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Multibeam’s 2024 Cover & Article Feature in Chip Scale Review magazine
Semiconductor Scaling with High-Productivity Multicolumn Electron Beam Lithography – by David K. Lam and Kenneth P. MacWilliams | Chip Scale Review
Multibeam’s 2024 Cover & Article Feature in Chip Scale Review magazine Read More »
Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System
Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production.
Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024
Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.
It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.
Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024 Read More »
Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards
Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards Read More »
Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards
Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards Read More »
Multibeam’s Feature in Semiconductor Digest Magazine
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!
Multibeam’s Feature in Semiconductor Digest Magazine Read More »
Multibeam’s Cover & Article with Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review
Multibeam’s Cover & Article with Chip Scale Review Read More »
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System Advanced lithography technology to serve as a key enabler for SkyWater’s domestic foundry roadmap to 45 nm SANTA CLARA, CA|BLOOMINGTON, MN – November 18, 2020SkyWater Technology,the trusted technology realization partner, and Multibeam Corporation, the maskless lithography technology leader, today disclosed a partnership
Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System
Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System $38 Million DoD Contract Awarded to Multibeam to Develop New MEBL Application SANTA CLARA, CA — September 10, 2020Multibeam Corporation todayconfirmed it has embarkedupon an ambitious project to apply its innovative Multicolumn E-Beam Lithography (MEBL) technology