Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards

Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! (Check out our feature on pg. 29 of the Yearbook)! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. We’re thrilled to be recognized by such an innovation-forward org for the work we’re doing in this space. Stay tuned!