SEMICON West 2024
Multibeam will be exhibiting at SEMICON West 2024 – find us at booth #5558!
Multibeam’s Cover & Article with Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review
Lithography Workshop – Sun Valley
Multibeam President Ken MacWilliams will give a presentation on game-changing capabilities enabled by Multibeam technology on May 3, 2023, during session S10.
GOMAC
Multibeam’s Ken MacWilliams will give a presentation on “High-Productivity Direct Write E-beam Accelerates Early Concept Prototyping and High Mix Production of Trusted and Assured Microelectronics”
E-beam Initiative – Luncheon Speaker
Founder and CEO Dr. David Lam participated as an invited speaker at the E-Beam Initiative lunch and gave an update on Multibeam’s Multicolumn E-Beam Litho system. The presentation went into a discussion around “Common Misconceptions about E-Beam Lithography”.
SPIE Adv Litho – Novel Patterning & E-Beam Initiative
Multibeam President, Ken MacWilliams presented “High-Productivity Direct Write E-Beam Lithography: An Enabling Patterning Technology to Augment Your Lithography Toolbox.” Founder and CEO Dr. David Lam also attended as an invited speaker at the E-Beam Initiative lunch.
BEST IN SESSION: ASCEND Space Conference
Multibeam President, Ken MacWilliams will be presenting “Enabling Next-Generation Space Systems with High Productivity Electron Beam Lithography”
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System Advanced lithography technology to serve as a key enabler for SkyWater’s domestic foundry roadmap to 45 nm SANTA CLARA, CA|BLOOMINGTON, MN – November 18, 2020SkyWater Technology,the trusted technology realization partner, and Multibeam Corporation, the maskless lithography technology leader, today disclosed a partnership …
Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System
Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System $38 Million DoD Contract Awarded to Multibeam to Develop New MEBL Application SANTA CLARA, CA – September 10, 2020Multibeam Corporation todayconfirmed it has embarkedupon an ambitious project to apply its innovative Multicolumn E-Beam Lithography (MEBL) technology …
Security Lithography
Security Lithography MARCH 3RD, 2020 – BY: MARK LAPEDUS At the recent SPIE Advanced Lithography conference, Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography for chip security applications. David Lam, chief executive and chairman of Multibeam, described how multi-beam lithography can be used to help thwart IC counterfeiting and tampering in …