Events Archives - Page 3 of 4

Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards

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Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.

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Multibeam feature in Semiconductor Digest

Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards

Leave a Comment / Events, Newsroom, Uncategorized / Shani

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Multibeam feature in Semiconductor Digest magazine

Multibeam’s Feature in Semiconductor Digest Magazine

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Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!

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GOMAC 2024

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Multibeam will be at the 2024 GOMAC conference and will be co-exhibiting in booth 509 with SkyWater Technology. Stop by to hear about the latest capabilities that our technologies are enabling in both defense and commercial spaces!

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2024 ECTC (Electronic Components & Technology Conference)

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Multibeam will be presenting a paper at the IEEE ECTC conference in 2024 in collaboration with Deca Technologies, detailing the ways in which our technology capabilities are enabling the next generation of heterogeneous integration! We are abstract number #782.

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2024 SPIE Advanced Lithography+Patterning

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Join us for a session on High-productivity maskless patterning at the deep submicron scale: An overview of Multibeam’s multicolumn e-beam lithography system at the 2024 SPIE Advanced Litho + Patterning conference. Join us on February 28, 2024 at 5:30 PM PST in the Convention Center, Hall 2!

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SEMICON West 2024

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Multibeam will be exhibiting at SEMICON West 2024 – find us at booth #5558!

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Multibeam’s Cover & Article with Chip Scale Review

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A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review

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Lithography Workshop – Sun Valley

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Multibeam President Ken MacWilliams will give a presentation on game-changing capabilities enabled by Multibeam technology on May 3, 2023, during session S10.

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GOMAC

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Multibeam’s Ken MacWilliams will give a presentation on “High-Productivity Direct Write E-beam Accelerates Early Concept Prototyping and High Mix Production of Trusted and Assured Microelectronics”

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