Multibeam will be at the 2024 GOMAC conference and will be co-exhibiting in booth 509 with SkyWater Technology. Stop by to hear about the latest capabilities that our technologies are enabling in both defense and commercial spaces!
Multibeam Presents at Synopsys SNUG Silicon Valley 2025 Read More »
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!
Multibeam’s 2024 Feature in Semiconductor Digest Magazine Read More »
Multibeam has been named the winner of a Gold Stevie® Award in the Manufacturing Technology category in the first annual Stevie Awards for Technology Excellence, “the Olympics for technology.”
SkyWater Announces Enhanced Capabilities with Multibeam’s First in Industry High Productivity Multicolumn E-Beam Lithography System
Multibeam President Dr. Ken MacWilliams sat down with Phil Alsop to talk about how Multibeam has been able to transcend traditional EBL productivity barriers and produce the world’s first Multicolumn E-Beam Litho PRODUCTION system for rapid time to market.
Multibeam’s Feature in Silicon Semiconductor Read More »
Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
Semiconductor Scaling with High-Productivity Multicolumn Electron Beam Lithography – by David K. Lam and Kenneth P. MacWilliams | Chip Scale Review
Multibeam’s 2024 Cover & Article Feature in Chip Scale Review magazine Read More »
Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production.
Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there!
MEMS & Sensors Technical Congress – MSTC 2024 Read More »
Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.
It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.
Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024 Read More »
