Following the launch of its Japan sales operation earlier this year and with fresh funding from global investors, Multibeam is now moving to fulfill demand for its E-Beam Lithography (EBL) production systems from semiconductor leaders in Taiwan.
Multibeam Corp. today announced that it has strengthened its global leadership bench by appointing three semiconductor industry executives to its Board of Directors. Elvino da Silveira, David J. Lam, and Amy Leong complete the Board that also includes Multibeam’s Chairman & CEO, David K. Lam and President, Ken MacWilliams.
Multibeam Adds Industry Leaders to Board of Directors Read More »
Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
Multibeam Secures $31 Million in Series B Funding Read More »
Multibeam Announces Launch of Japan Sales Office
Multibeam Announces Launch of Japan Sales Office Read More »
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!
Multibeam’s 2024 Feature in Semiconductor Digest Magazine Read More »
Multibeam has been named the winner of a Gold Stevie® Award in the Manufacturing Technology category in the first annual Stevie Awards for Technology Excellence, “the Olympics for technology.”
SkyWater Announces Enhanced Capabilities with Multibeam’s First in Industry High Productivity Multicolumn E-Beam Lithography System
Multibeam President Dr. Ken MacWilliams sat down with Phil Alsop to talk about how Multibeam has been able to transcend traditional EBL productivity barriers and produce the world’s first Multicolumn E-Beam Litho PRODUCTION system for rapid time to market.
Multibeam’s Feature in Silicon Semiconductor Read More »
Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
Semiconductor Scaling with High-Productivity Multicolumn Electron Beam Lithography – by David K. Lam and Kenneth P. MacWilliams | Chip Scale Review
Multibeam’s 2024 Cover & Article Feature in Chip Scale Review magazine Read More »
