Multibeam Corp. today announced the appointment of Regina Freed as Chief Technology Officer. A seasoned technology strategist with more than 20 years of experience driving large-scale technology programs and enterprise-wide digital transformation initiatives, Regina will lead Multibeam’s technical strategy, process, and innovation roadmap.
Multibeam Corp. today named semiconductor capital equipment executive, Andre Linden, as Senior Vice President of Sales. A patterning and lithography expert, Andre has spent 25+ years scaling high-performance sales organizations to deliver innovative technologies to manufacturing leaders in international markets. He succeeds Roger Van Art who left for new opportunities.Multibeam Corp. today named semiconductor capital equipment executive, Andre Linden, as Senior Vice President of Sales. A patterning and lithography expert, Andre has spent 25+ years scaling high-performance sales organizations to deliver innovative technologies to manufacturing leaders in international markets. He succeeds Roger Van Art who left for new opportunities.
Multibeam has been invited to present at the 2026 Litho Workshop in Sedona, AZ. Multibeam will present the latest updates on the MB platform, extended capabilities and applications it is positioned to bolster, and what’s next on the company’s product evolution roadmap.
Multibeam to Present at 2026 Litho Workshop Read More »
Multibeam will be presenting at the 2026 AP International conference in the Heterogeneous Integration track. Multibeam president Ken MacWilliams will discuss how high-productivity multi-column EBL can enable the next generation of advanced integration.
Multibeam to Present at Advanced Packaging (AP) International 2026 Read More »
Multibeam was invited to present at the 2025 PDF Users Group Conference on the groundbreaking capabilities that the Multi-column EBL system is bringing to the industry, and how PDF Solutions technology plays in the inner workings of the system.
Multibeam Presents in Session 1 at PDF Solutions Users Group 2025 Read More »
Following the launch of its Japan sales operation earlier this year and with fresh funding from global investors, Multibeam is now moving to fulfill demand for its E-Beam Lithography (EBL) production systems from semiconductor leaders in Taiwan.
Multibeam Corp. today announced that it has strengthened its global leadership bench by appointing three semiconductor industry executives to its Board of Directors. Elvino da Silveira, David J. Lam, and Amy Leong complete the Board that also includes Multibeam’s Chairman & CEO, David K. Lam and President, Ken MacWilliams.
Multibeam Adds Industry Leaders to Board of Directors Read More »
Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
Multibeam Secures $31 Million in Series B Funding Read More »
Multibeam collaborated with University of Arkansas’ Multi-User Silicon Carbide facility team to demonstrate the benefits of leveraging Multibeam lithography to pattern over non-planar SiC wafers compared to traditional optical lithography.
Multibeam Presents Joint Paper with U of Arkansas at CS ManTech 2025 Read More »
Multibeam Announces Launch of Japan Sales Office
Multibeam Announces Launch of Japan Sales Office Read More »
