Events
Find out about current and upcoming events.
Multibeam to Present at 2026 Litho Workshop
Multibeam has been invited to present at the 2026 Litho Workshop in Sedona, AZ. Multibeam will present the latest updates on the MB platform, extended capabilities and applications it is positioned to bolster, and what’s next on the company’s product evolution roadmap.
Multibeam to Present at Advanced Packaging (AP) International 2026
Multibeam has been invited to present at the 2026 AP International conference in the Heterogeneous Integration track. Multibeam president Ken MacWilliams will discuss how high-productivity multi-column EBL can enable the next generation of advanced integration.
Multibeam Presents in Session 1 at PDF Solutions Users Group 2025
Multibeam was invited to present at the 2025 PDF Users Group Conference on the groundbreaking capabilities that the Multi-column EBL system is bringing to the advanced integration industry, and the role PDF Solutions technology plays in the inner workings of the system.
Multibeam Partners with Marketech to Accelerate Sales of its Multi-column E-Beam Lithography (MEBL) Systems in Taiwan
Following the launch of its Japan sales operation earlier this year and with fresh funding from global investors, Multibeam is now moving to fulfill demand for its E-Beam Lithography (EBL) production systems from semiconductor leaders in Taiwan.
Read the full press release here: https://www.globenewswire.com/news-release/2025/10/08/3163416/0/en/Multibeam-Partners-with-Marketech-to-Accelerate-Sales-of-its-Multiple-Column-E-Beam-Lithography-EBL-Systems-in-Taiwan.html
Multibeam Adds Industry Leaders to Board of Directors
Multibeam Corp. today announced that it has strengthened its global leadership bench by appointing three semiconductor industry executives to its Board of Directors. Elvino da Silveira, David J. Lam, and Amy Leong complete the Board that also includes Multibeam’s Chairman & CEO, David K. Lam and President, Ken MacWilliams.
Read the full press release here:
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Multibeam Secures $31 Million in Series B Funding
Multibeam Corp. announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc. (NYSE: ONTO), a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm of Lam Research Corp. (NASDAQ: LRCX), a global provider of wafer fabrication equipment and services for the semiconductor industry. Participants also include UMC Capital, the venture capital arm of UMC Corp. (NYSE: UMC), and MediaTek Capital, the venture capital arm of MediaTek Inc. (TWSE: 2454.TW). Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors.
Read the full press release here:
Multibeam Presents at CHIPcon 2025
Multibeam presented at CHIPcon San Jose, 2025 to explore how MEBL can enable the next generation of advanced packaging
Multibeam Presents Joint Paper with U of Arkansas at CS ManTech 2025
Multibeam collaborated with University of Arkansas’ Multi-User Silicon Carbide facility team to demonstrate the benefits of leveraging Multibeam lithography to pattern over non-planar SiC wafers compared to traditional optical lithography.
Multibeam Announces Launch of Japan Sales Office
The development marks a new phase in Multibeam’s growth strategy. It follows the launch of the company’s multicolumn EBL production system and inaugural shipment to foundry leader, SkyWater Technology.
Multibeam Presents at Synopsys SNUG Silicon Valley 2025
Multibeam will be presenting at Synopsys’ 2025 SNUG Silicon Valley event. Catch Multibeam President Ken MacWilliams’ presentation titled “Co-optimization of chips and packages enabling higher performance through Advanced Integration.”