Strategic Partners
We partner with companies that share our commitment to positively transform the industry's production of next-generation ICs.
Together, we are Accelerating Chip Innovation.
Together, Synopsys and Multibeam are enabling chip designers and chip manufacturers to bring new ideas to life, faster and more efficiently.
Synopsys and Multibeam collaborate to accelerate system-level optimization. Multibeam’s data preparation system leverages Synopsys CATS software – it is fully integrated into the software of each Multibeam system. This enables both physics-based and model-based corrections, seamless handling of GDSII, OASIS, and MULTIGON formats, and compatibility with system-level EDA.
Check out our joint blog below.
SkyWater’s Minnesota production facility is home to Multibeam’s MB200 platform. The system enhances SkyWater’s Technology as a Service offerings, enabling faster early concept prototyping and rapid production of next-generation ICs.
SkyWater and Multibeam collaborate to accelerate innovative new technologies. Multibeam enables several new production capabilities for SkyWater’s customers including Secure Chip ID for anti-counterfeit applications and full wafer patterning to support focal plane read-out ICs and other types of large format die. The system offers large depth of focus for a range of high topology microfluidic and MEMS architectures, curvilinear designs for photonics, and high-density MOS. In addition, it is the only production lithography tool capable of sub 50 nm geometries on 200 mm wafers enabling early concept prototyping of advanced technologies.
Check out our joint press announcement below.
Structural Capital is providing financial backing to Multibeam to accelerate Multibeam’s product roadmap and accelerate overall growth.
Investor Partners
Onto Innovation is one of four global investors in Multibeam’s Series B funding round – an effort that is being leveraged to accelerate development of its next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography.
Onto Innovation CEO, Michael Plisinski: “For the last decade, advances in packaging have ushered in new eras for semiconductors. First, the adoption of copper pillar and fan-out packaging helped power the mobile era and now chiplet architectures are powering the AI era. Future innovation lies in advanced packaging solutions. For packaging with interconnects below 1µm, we see enormous potential for Multibeam’s direct-write lithography technology to enable denser interconnects between chips cost-effectively. Multibeam has taken a novel lithography technology from concept to mass production to address the growing need for advanced integration of chips on large substrates. As such, we are very pleased to lead this Series B investment round.”
Lam Capital is one of four global investors in Multibeam’s Series B funding round – an effort that is being leveraged to accelerate development of its next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography.
Audrey Charles, Senior Vice President of Corporate Strategy and Advanced Packaging, Lam Research; President, Lam Capital: “Heterogenous chip-to-chip integration is essential for delivering the lower power, higher performance semiconductors needed to meet the rapidly escalating demands of AI compute. Multibeam, with its disruptive, innovative miniaturized design, has developed an e-beam lithography system that has the potential to deliver unparalleled patterning flexibility for emerging chiplet applications at the wafer scale and beyond.”
Lam Capital is the venture capital group of Lam Research Corporation (NASDAQ: LRCX). Their mission is to accelerate innovation by making strategic investments in private companies and venture funds that drive semiconductor breakthroughs which define the next generation, with a focus on high-impact areas including semiconductor manufacturing, artificial intelligence & advanced packaging, specialty technologies & optoelectronics, automation, and sustainability.
UMC Capital is one of four global investors in Multibeam’s Series B funding round – an effort that is being leveraged to accelerate development of its next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography.
UMC Capital President, Kris Peng: “Multibeam has developed a highly flexible lithography tool capable of patterning fine features across full wafers. This new type of direct-wafer writing system with high resolution, large depth of focus, and wafer-scale field of view, opens the aperture on the type of chips that can be made.”
MediaTek Capital is one of four global investors in Multibeam’s Series B funding round – an effort that is being leveraged to accelerate development of its next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography.
MediaTek Capital Partner, Brian Hsu: “Multibeam’s system enables rapid time to prototype and time to market. These new capabilities enable agile development of a wide variety of novel and diverse applications.”
Memberships
Multibeam is a proud member of the ASU SWAP Hub. The SWAP Hub brings together over 200 top semiconductor manufacturers, defense firms, national laboratories, leading academic institutions, startup companies and numerous other organizations, in a collaborative ecosystem leveraging innovative advanced packaging, test, characterization, and fabrication capabilities. Multibeam’s advanced integration enabling capabilities will play a key role here
Multibeam is a proud member of the 3D InCites community – a collaborative ecosystem bringing together leading companies across the semiconductor industry, with a focus on all things 3D integration and advanced packaging. Multibeam’s advanced integration enabling capabilities play a key role in driving multi-chip module performance to new heights.
Multibeam is a proud member of the SEMI community, with active engagements in the Semi Mems & Sensors Group (MSIG), and the Semi Advanced Packaging and Heterogeneous Integration (APHI) Group.
SEMI is a catalyst for connection, collaboration and innovation, helping the semiconductor industry to deploy lifechanging tech worldwide, connecting 1.5 million professionals from across the semiconductor and electronics design and manufacturing supply chain.
Dr. David Lam
Chief Executive Officer and Chairman of the
Board
Recognizing the opportunity for productive direct write lithography, Dr. Lam joined Multibeam in 2010. Dr. Lam is well known for his impact on creating what was later named ‘Moore’s Law’ when he developed the first single wafer, cassette-to-cassette plasma etch system and launched the > $60B semiconductor company, Lam Research. Dr. Lam is a regular invited speaker to lithography, semiconductor, and entrepreneurial events where he is a tireless advocate for the benefits of the company’s high productivity direct write multiple electron beam systems in solving the current challenges of security, internet of things chiplet integration, rapid prototyping, advanced packaging, and emerging applications across multiple semiconductor technologies.
Dr. Ken MacWilliams
President and Multibeam Board Member
Dr. MacWilliams brings decades of experience in semiconductor device, process and equipment innovations. He joined Multibeam in 2020 to help productize the world’s first cost-effective direct write lithography system. Dr. MacWilliams has launched multiple novel equipment platforms and processes with the world’s leading semiconductor manufacturers. He held senior management positions with several high tech companies, including Applied Materials, Veeco, Yield Engineering Systems (YES) and Novellus (acquired by Lam Research). He holds Ph.D and MS Electrical Engineering degrees from Stanford University. He is an NSF Fellow with over 100 publications and more than a dozen patents.
Eli Vronsky
Senior Vice President of Productization
Mr. Vronsky brings over 25 years of experience in the conversion of disruptive new technologies into commercial products, driving innovation, industry acceptance, and high volume growth. While at Kateeva, he lead teams to bring new direct-write products to market in the display space. These products serve leading-edge technology applications as well as high-volume production ramps globally for the world’s most demanding customers.
Ted Prescop
Vice President of Technology
Mr. Prescop leads the technology and application development of Multibeam’s proprietary MEBL systems. He has experience in semiconductor chip design, process development, and metrology at fabless foundries, KLA-Tencor and Veeco. Mr. Prescop holds B.S. and M.S. degrees in Engineering Physics and Mechanical Engineering, respectively, from UC Berkeley.
Roger Van Art
Senior Vice President Strategic Business
Mr. Van Art works closely with government and industry to develop new applications for use in semiconductor security, low volume/high complexity applications, and other electron beam direct write applications needed for defense, aerospace, and critical domestic infrastructure. His recent experiences include General Manager, Aerospace & Defense, at pure-play foundry Jazz Semiconductor as well as Vice President of Strategy, at Aeroflex Corp., a radiation-hardened fabless entity. His work in the government sector includes Branch Chief for the Directorate of Science & Technology in the Intelligence Community, collaborating with multiple US agencies. Mr. Van Art holds a B.S. Electrical Engineering from Penn State.
Lynn Barringer
Treasurer and Multibeam Board Member
Ms. Barringer serves on the Multibeam Board and as Treasurer. She previously held several active management roles in Multibeam during its corporate development. She also has held numerous Director, Vice President, and CFO roles at top-tier companies, including Bank of America’s California Commercial Division, Conner Peripherals (now part of Seagate Technology), Avanti Corp, and JAFCO America Ventures. She provides CFO advisory services and other guidance on the board to assure the success of Multibeam.