Multibeam was invited to present at the 2025 PDF Users Group Conference on the groundbreaking capabilities that the Multi-column EBL system is bringing to the advanced integration industry, and the role PDF Solutions technology plays in the inner workings of the system.
Multibeam President Ken MacWilliams presented right after Intel Corporation in the E-Beam Solutions session and talked all about how the company is enabling innovators to fast-track next-generation IC designs to production with capabilities that are bolstering the performance of chip-chip interconnects beyond what is presently capable with current systems on the market.
