5 Facts About MEBL You May Not Know

1. Variable Column Counts

It’s no secret that our system uses multiple e-beam columns to operate. However, it’s worth noting that the number of columns in action at any time can vary. MEBL (Multicolumn Electron Beam Lithography) systems typically alternate between 9 to 25 columns (dependent on substrate size), the amount of which is controlled by the current system operator.

2. Expanded Field of View

Multibeam systems offer an incredibly wide field of view (FoV) in comparison to conventional e-beam, ranging from between 10-100x wider field. This is complimented by <100nm of resolution, exceeding the precision of optical by a large margin. This FoV enables our system to pattern full wafer-sized interposers which, as an industry standard, are currently struggling to exceed 3x reticle sizes.

3. Write on the Fly Capability

Each of the columns in MEBL operate simultaneously while still writing independently of the others as the stage is in motion. The combined operation of each column leads to a 21x increase in throughput compared to standard e-beams. Additionally, Multibeam’s inherent software, coupled with our partner Synopsys’ CATS data prep software, allows the beam columns to automatically adjust throughout the process to account for things like die-shift, which is a common occurrence in the advanced packaging process. With MEBL adaptable patterning, Multibeam can consistently write interconnects with line widths of 200nm and pitches of 400nm, guaranteeing accuracy in the event of a die shift and giving users the ability to modify a design if needed, without needing to create a new mask.

4. Modular System

Multibeam writing modules are designed to fit together based on fabrication needs. This allows up to three modules to be in production at once, which can help boost throughput even further to accommodate production needs. What’s more, due to its compact size, one 3-module system is still significantly smaller than an EUV lithography system. However, that compact size doesn’t hinder productivity, as each individual module can maintain a steady throughput of 2-25wph depending on the pattern. With a 3-module system, chip producers can have rapid production of purpose-built chips.

5. On Wafer Die-to-Die Stitching

Chiplets are the current solution to the stagnation of Moore’s law, but fabricating die-die interconnects with maximum performance has been difficult. However, MEBL systems can enable chip to chip communications to approach the performance of on-die communications. This allows chip makers to produce chip-chip architectures with performance comparable to that of monolithic chips, extending the limits of Moore’s law.