Multibeam Corp. today announced the signing of a $140 million Letter of Intent with the U.S. Department of Commerce to accelerate R&D for fine-pitch advanced packaging and heterogeneous chip integration. The initiative aims to strengthen U.S. semiconductor innovation and enable more power-efficient, high-performance systems for AI, HPC, and other emerging applications.

Read the full press release here: Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce