Technical Advisory Board
Andrew M. Hawryluk, Ph.D.
Dr. Hawryluk received his B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT where he majored in semiconductor processing, lasers and lithography. Dr. Hawryluk joined the Lawrence Livermore National Laboratory (LLNL) in 1983 where he developed EUV optical components, sources and systems which ultimately led to the first publication and patent for EUV Lithography in 1988. From 1990-1996, he was the Deputy Program Manager for the Advanced Microtechnology Program at LLNL which developed EUV lithography, Giant Magneto-Resistive sensors for disk drives and Flat Panel Display technologies. He transferred these technologies to industrial partners for commercial products.
Dr. Hawryluk jointed Ultratech in 1996 as Director of Engineering for Lithography and became Vice President of Engineering for Laser Annealing in 1998 where he developed the first commercial melt-tool for dopant activation. In 2005, Dr. Hawryluk became Ultratech’s Senior Vice President of Engineering and in 2008 was promoted to Senior Vice President and Chief Technology Officer. He was the Chairman of Ultratech’s Technical Advisory Board and was responsible for managing Ultratech’s patent portfolio, which held over 1000 patents and applications.
From 2018 through 2025, Dr. Hawryluk consulted with various startup companies including LytEn (a Li-S battery startup) and Aligned Carbon (a carbon nanotube startup). He has also been a patent analyst for several patent infringement lawsuits.
Dr. Hawryluk was the President of the Lithography Workshop, an international organization that hosts a conference with the world’s leaders in lithography and is currently on their Board of Directors. He. holds more than 50 US patents (over 200 world-wide patents), has over 50 publications in referred journals, received 7 R&D-100 awards, is the recipient of the 1986 DOE Award of Excellence and the 2009 SEMI award for contributions to semiconductor manufacturing.
Tim Michalka, Ph.D.
Tim Michalka has spent his career working on various aspects of electrical packaging and interconnections with an emphasis on signal and power integrity. He received a BS EE degree from the University of Mine in 1982 and MSEE & PhD EE degrees from Stanford University in 1983 and 1988. His industrial career began at Digital Equipment Corporation where he worked on electrical design aspects of IC packaging advanced development. At Carborundum Microelectronics he led the electrical analysis of aluminum nitride-based electronics packaging products. At Hewlett Packard he developed power integrity analysis methods for PA-RISC microprocessors and managed the electrical team overseeing package design and signal & power integrity analysis for server microprocessors and ASIC. At Qualcomm he founded and led Qualcomm’s primary signal & power integrity team which supported the development and production of the Qualcomm SOC chipset product portfolio. He retired from full-time work in 2022.
Elvino De Silveria
Elvino da Silveira whose four-decade career in the semiconductor capital equipment industry includes extensive experience leading lithography teams. Before retiring, Elvino was General Manager of Onto Innovation’s lithography unit where he led the product line transition from wafer level advanced packaging to panel-based heterogeneous packaging applications. Earlier roles included executive positions at Rudolph Technologies, Azores Corporation (acquired by Rudolph), and MRS Technology. He holds a B.S. in Mechanical Engineering from Northeastern University.
E. Jan Vardaman
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI and IMAPS. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Dr. David Lam
Chief Executive Officer and Chairman of the
Board
Recognizing the opportunity for productive direct write lithography, Dr. Lam joined Multibeam in 2010. Dr. Lam is well known for his impact on creating what was later named ‘Moore’s Law’ when he developed the first single wafer, cassette-to-cassette plasma etch system and launched the > $60B semiconductor company, Lam Research. Dr. Lam is a regular invited speaker to lithography, semiconductor, and entrepreneurial events where he is a tireless advocate for the benefits of the company’s high productivity direct write multiple electron beam systems in solving the current challenges of security, internet of things chiplet integration, rapid prototyping, advanced packaging, and emerging applications across multiple semiconductor technologies.
Dr. Ken MacWilliams
President and Multibeam Board Member
Dr. MacWilliams brings decades of experience in semiconductor device, process and equipment innovations. He joined Multibeam in 2020 to help productize the world’s first cost-effective direct write lithography system. Dr. MacWilliams has launched multiple novel equipment platforms and processes with the world’s leading semiconductor manufacturers. He held senior management positions with several high tech companies, including Applied Materials, Veeco, Yield Engineering Systems (YES) and Novellus (acquired by Lam Research). He holds Ph.D and MS Electrical Engineering degrees from Stanford University. He is an NSF Fellow with over 100 publications and more than a dozen patents.
Eli Vronsky
Senior Vice President of Productization
Mr. Vronsky brings over 25 years of experience in the conversion of disruptive new technologies into commercial products, driving innovation, industry acceptance, and high volume growth. While at Kateeva, he lead teams to bring new direct-write products to market in the display space. These products serve leading-edge technology applications as well as high-volume production ramps globally for the world’s most demanding customers.
Ted Prescop
Vice President of Technology
Mr. Prescop leads the technology and application development of Multibeam’s proprietary MEBL systems. He has experience in semiconductor chip design, process development, and metrology at fabless foundries, KLA-Tencor and Veeco. Mr. Prescop holds B.S. and M.S. degrees in Engineering Physics and Mechanical Engineering, respectively, from UC Berkeley.
Roger Van Art
Senior Vice President Strategic Business
Mr. Van Art works closely with government and industry to develop new applications for use in semiconductor security, low volume/high complexity applications, and other electron beam direct write applications needed for defense, aerospace, and critical domestic infrastructure. His recent experiences include General Manager, Aerospace & Defense, at pure-play foundry Jazz Semiconductor as well as Vice President of Strategy, at Aeroflex Corp., a radiation-hardened fabless entity. His work in the government sector includes Branch Chief for the Directorate of Science & Technology in the Intelligence Community, collaborating with multiple US agencies. Mr. Van Art holds a B.S. Electrical Engineering from Penn State.
Lynn Barringer
Treasurer and Multibeam Board Member
Ms. Barringer serves on the Multibeam Board and as Treasurer. She previously held several active management roles in Multibeam during its corporate development. She also has held numerous Director, Vice President, and CFO roles at top-tier companies, including Bank of America’s California Commercial Division, Conner Peripherals (now part of Seagate Technology), Avanti Corp, and JAFCO America Ventures. She provides CFO advisory services and other guidance on the board to assure the success of Multibeam.