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CEBL Solutions
Multibeam builds arrays of e-beam
columns. Each array
deploys approximately 100 columns (for 300mm
wafers). A wafer is positioned under the array, and
all columns pattern the wafer simultaneously. To
achieve high throughput, multiple patterning modules
are combined into a cluster system.
For more details on how CEBL can meet
both high-volume and low-volume requirements, see
Applications.
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