Events

Find out about current and upcoming events.

Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards

Feb 6, 2024

Multibeam has been selected as a WINNER of the 2024 3D InCites Advanced Technology Enablement Awards! (Check out our “Finalist” feature on pg. 29 of the Yearbook)! We will be at IMAPS DPC in Arizona to accept the award – meet us there!

The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.

Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth.

Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards

Jan 8, 2024

Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! (Check out our feature on pg. 29 of the Yearbook)! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. We’re thrilled to be recognized by such an innovation-forward org for the work we’re doing in this space. Stay tuned!

Multibeam’s Feature in Semiconductor Digest Magazine

Jan 1, 2024

Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!

GOMAC 2024

Mar 18, 2024
Charleston, SC, USA

Multibeam will be at the 2024 GOMAC conference and will be co-exhibiting in booth 509 with SkyWater Technology. Stop by to hear about the latest capabilities that our technologies are enabling in both defense and commercial spaces!

2024 ECTC (Electronic Components & Technology Conference)

May 28, 2024
Denver, CO

Multibeam will be presenting two papers at the IEEE ECTC conference in 2024. Each paper is in collaboration with Deca Technologies, and hones in on how our technology capabilities are enabling the next generation of heterogeneous integration! We are abstracts numbers #644 and #782.

2024 SPIE Advanced Lithography+Patterning

Feb 28, 2024
San Jose, CA – Convention Center

Multibeam will present High-productivity maskless patterning at the deep submicron scale: An overview of Multibeam’s multicolumn e-beam lithography system at the 2024 SPIE Advanced Litho + Patterning conference. Join us on February 28, 2024 at 5:30 PM PST in the Convention Center, Hall 2!