Multibeam News  
February 2020
David K. Lam to unveil "Security Lithography" advances to thwart IC
Counterfeiting at SPIE Lithography Conference
October 2019
Multibeam unveils anti-counterfeit IC initiative funded by new contract
July 2018
Technology roadmap disclosed at litho and device security workshops
January 2018
Patent enhances precision direct etch
November 2017
Multibeam patent improves accuracy
September 2017
Dr. David K Lam presented at the
IoT Device Security Summit
July 2017
Dr. David K Lam presented at Semicon
May 2017
Multibeam secures $35M defense contract to build E-Beam System
A Fresh Approach to Electron Writing

Multibeam is the leading innovator of Multicolumn E-Beam Lithography (MEBL).

At its core, the technology is comprised of miniature e-beam columns that write patterns on wafers without masks. These columns are the smallest of their kind – at 5 inches in height and 1 inch in diameter – and are combined into a multicolumn array for efficient and powerful full wafer patterning.

The columns operate at very high speeds, independently and in parallel, and target each electron beam onto the wafer with extremely high accuracy to meet critical overlay requirements for IC production.

The MEBL writing module – the heart of the system – is small, thanks to Multibeam’s miniature column technology. The small footprint and modular architecture enable scaling for high volume production and provide a flexible platform for a wide range of applications.


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