Multibeam News  
November 2017
Multibeam patent improves accuracy
 
September 2017
Dr. David K Lam presented at the
IoT Device Security Summit
 
July 2017
Dr. David K Lam presented at Semicon
 
May 2017
Multibeam Secures $35M Defense Contract to Build E-Beam System
 
November 2016
SST article: Multibeam Patents Direct Deposition and Etch
 
September 2016
eBeam Initiative: Embedding IoT Chip Security using eBeam
 
November 2015
Multibeam Opens New Headquarters
 
More  
 
 
A Fresh Approach to Electron Writing
 
   
 

Unlike conventional Electron-Beam Lithography (EBL) systems that employ a single complex e-beam column writing pixels, Multibeam takes a fresh approach in column design, system architecture, and writing strategy.

Multibeam's miniature columns have a streamlined design capable of writing patterns at very high resolution. Identical columns are assembled into an array. Each electron beam is individually controlled with high-speed electronics. Beam positions are automatically registered to the wafer for overlay accuracy. Operating simultaneously, the columns pattern critical wafer layers with low pattern density in less than 12 minutes or faster, depending on application. Cluster tools with multiple e-beam modules speed throughput for high-volume manufacturing. Single- or multi-module Multibeam systems can be inserted into existing manufacturing fabs running 200mm or 300mm wafers.

 

Contact us today. Submit your Request for Proposal.

   
       
 
 
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