Multibeam News  
March 2020
Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography
 
February 2020
David K. Lam to unveil "Security Lithography" advances to thwart IC
Counterfeiting at SPIE Lithography Conference
 
October 2019
Multibeam unveils anti-counterfeit IC initiative funded by new contract
 
July 2018
Technology roadmap disclosed at litho and device security workshops
 
January 2018
Patent enhances precision direct etch
 
November 2017
Multibeam patent improves accuracy
 
September 2017
Dr. David K Lam presented at the
IoT Device Security Summit
 
July 2017
Dr. David K Lam presented at Semicon
 
May 2017
Multibeam secures $35M defense contract to build E-Beam System
 
More  
 
 
Scalable Approach to E-Beam Writing
 
   
 

Multibeam is the leading innovator of Multicolumn E-Beam Lithography (MEBL).

At the heart of the companyís proprietary MEBL technology is a miniaturized e-beam column (6 inches high; 1 inch diameter). The column owes its compact size to an innovative all-electrostatic design that eliminates the large magnetic coils required in traditional e-beam columns.

Multibeam arranges its miniature columns in arrays within compact modules. Each mini-column in an array generates one electron beam, controls its shape and trajectory, and focuses it onto the wafer to write circuit patterns. All columns in an array write independently and in parallel to achieve unprecedented e-beam writing speed in production environments.

MEBLís rapid, scalable writing is facilitated by a proprietary data preparation system. As MEBL is maskless, the DPS bridges the path from a database in industry-standard GDSII or Oasis format, where IC layout data for each and all layers is stored, to all MEBL column controllers. Each MEBL column controller individually directs its e-beam to write patterns on the wafer, all at the same time.

Each module comprises a multi-column array, precision wafer stage, and high-accuracy feedback control that seamlessly integrates with other sensors and subsystems required for high-precision lithography. The small MEBL module footprint (approximately 2 feet by 2.5 feet) is about the size of a plasma-etch module, making it compatible with commercial wafer-handling mainframes and easing integration of multiple modules.

In a multi-module MEBL system, each module can be optimized for a specific process or application. Alternatively, all modules can run the same process to achieve higher throughput. Modular scalability enables extraordinary flexibility to meet throughput and other requirements of an IC production fab.

 

 

Contact us today. Submit your Request for Proposal.

   
     
 
 
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