Multibeam News  
July 2017
David K Lam presents at Semicon
May 2017
Multibeam Secures $35M Defense Contract to Build E-Beam System
November 2016
SST article: Multibeam Patents Direct Deposition and Etch
September 2016
eBeam Initiative Tech Talk video:
Embedding IoT Chip Security using eBeam Solutions
July 2016
Ed Sperling, Semi. Engineering interview of David K Lam: Securing Chips During Manufacturing
June 2016
GSA Forum: Reducing IC Cost While Enhancing IoT Security
November 2015
Multibeam Opens New Headquarters
A Fresh Approach to Electron Writing

Unlike conventional Electron-Beam Lithography (EBL) systems that employ a single complex e-beam column writing pixels, Multibeam takes a fresh approach in column design, system architecture, and writing strategy.

Multibeam's miniature columns have a streamlined design capable of writing patterns at very high resolution. Identical columns are assembled into an array. Each electron beam is individually controlled with high-speed electronics. Beam positions are automatically registered to the wafer for overlay accuracy. Operating simultaneously, the columns pattern critical wafer layers with low pattern density in less than 12 minutes or faster, depending on application. Cluster tools with multiple e-beam modules speed throughput for high-volume manufacturing. Single- or multi-module Multibeam systems can be inserted into existing manufacturing fabs running 200mm or 300mm wafers.


Contact us today. Submit your Request for Proposal.

   2017 Multibeam Corporation. All rights reserved.