Multibeam News  
July 2018
Technology roadmap disclosed at litho and device security workshops
January 2018
Patent enhances precision direct etch
November 2017
Multibeam patent improves accuracy
September 2017
Dr. David K Lam presented at the
IoT Device Security Summit
July 2017
Dr. David K Lam presented at Semicon
May 2017
Multibeam Secures $35M Defense Contract to Build E-Beam System
November 2016
SST article: Multibeam Patents Direct Deposition and Etch
September 2016
eBeam Initiative video: Embedding IoT Chip Security using eBeam
CEBL Solutions



Multibeam builds arrays of e-beam columns. Each array deploys approximately 100 columns (for 300mm wafers). A wafer is positioned under the array, and all columns pattern the wafer simultaneously. To achieve high throughput, multiple patterning modules are combined into a cluster system. For more details on how CEBL can meet both high-volume and low-volume requirements, see Applications. 





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