Headlines  
November 2016
SST article: Multibeam Patents
Direct Deposition and Direct Etch
 
September 2016
eBeam Initiative presentation:
Embedding IoT Chip Security using eBeam Solutions
 
July 2016
Semiconductor Engineering Interview:
David Lam on IoT Security
 
June 2016
Reducing IC Manufacturing Cost While Enhancing IoT Security
 
November 2015
Semiconductor Engineering Interview:
Inside Multibeam E-beam lithography
 
November 2015
Multibeam Opens New Headquarters
 
   
 
 
CEBL Solutions
   
 

 

   
 

Multibeam builds arrays of e-beam columns. Each array deploys approximately 100 columns (for 300mm wafers). A wafer is positioned under the array, and all columns pattern the wafer simultaneously. To achieve high throughput, multiple patterning modules are combined into a cluster system. For more details on how CEBL can meet both high-volume and low-volume requirements, see Applications. 

 

   
 

 

   
 

   
       
 
 
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