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CEBL Solutions

Multibeam builds arrays of e-beam columns. Each array deploys approximately 100 columns (for 300mm wafers). A wafer is positioned under the array, and all columns pattern the wafer simultaneously. To achieve high throughput, multiple patterning modules are combined into a cluster system.

For more details on how CEBL can meet both high-volume and low-volume requirements, see Applications.

     
     
     
   
     
     
     
     
     
     
     
     
     
     
     
     
     
     
     
     

 

 
 
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