March 2020
Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography
At the recent SPIE Advanced Lithography conference,
David Lam, chief executive and chairman of Multibeam, described how multi-beam lithography can be used to help thwart IC counterfeiting and tampering in the market. This lithography technology can be used to embed a unique ID into each IC during wafer fabrication.


February 2020
David K. Lam to unveil "Security Lithography" advances to thwart IC Counterfeiting at SPIE Lithography Conference
Silicon Valley Hall of Famer and Founder of Lam Research to present unsurpassed levels of on-chip security enabled by Multicolumn E-Beam Lithography (MEBL)



October 2019
Multibeam unveils anti-counterfeit IC initiative funded by $8.2 Million defense contract

The project centers on technology to verify the identity, authenticity and provenance of each chip at any point in the supply chain.


July 2018
Multicolumn e-beam technology roadmap disclosed at lithography and device security workshops

Dr. David K. Lam details systems progress, applications outlook and market positioning for Multibeam’s innovative miniature e-beam columns.


May 2018
ShareAmerica article: This Asian-American tech entrepreneur tried harder

ShareAmerica, an online publication produced by the U.S. State Department, interviewed David K. Lam on his experience as an immigrant and entrepreneur.


January 2018
Multibeam patent enhances highly-localized precision material removal in advanced semiconductor manufacturing

Innovative solution enables precise, local etch directly from the design layout database in the fabrication of advanced devices. Multibeam's miniature e-beam columns direct electrons to precise locations on the wafer to activate chemical processes. Innovative use of gas "lenses" increase throughput.


November 2017
Multibeam patent enables high accuracy in multi-column e-beam writing, processing, and inspection

Innovative use of “Hadamard” patterns enhances both wafer alignment and beam placement accuracy in four key multi-column e-beam applications.


September 2017
Multibeam joint presentation with Mike Borza (Synopsys) at IoT Device Security Summit

Thursday, September 28 4:00pm
Santa Clara Convention Center, Santa Clara


July 2017
David K Lam presentation at Semicon West: Bridging the IoT Security Chasm

Wednesday, July 12 12:00pm
Moscone Center, San Francisco


May 2017
Multibeam secures $35M defense contract to build E-Beam System

Advanced multicolumn e-beam platform enables new solutions for IC makers, including low-volume production litho and embedded chip security.


November 2016
SST article: Multibeam Patents Direct Deposition and Direct Etch

E-beams directed by design to form and repair device structures.
Ed Korczynski, Solid State Technology



October 2016
Patent Pioneers Single-Tool Wafer Inspection and Defect Review

Multibeam expanded its e-beam patent portfolio with innovations that significantly improve wafer inspection and defect review using a single tool.


October 2016
Multibeam Adds Two E-Beam Patents for Advanced IC Fabrication

Innovative solutions enable precise, local deposition and etch directly from the design layout database in the fabrication of advanced devices. Significantly, the inventions broaden Multibeam's common platform by leveraging two key attributes: precision placement of electrons on the wafer to activate chemical processes such as deposition and etch, and multi-column parallel processing to increase throughput.


September 2016
eBeam Initiative Tech Talk video: Embedding IoT Chip Security using eBeam Solutions

Can the connected world be more secure? Dr. David K Lam discusses how eBeam technology can create the foundation for a more secure connected world by enabling IC-embedded security for Internet of Things (IoT) devices.
Watch the video...


July 2016
Semiconductor Engineering interview of Dr. Lam: Securing Chips During Manufacturing

Can directed electron writing change the security equation? Dr. Lam, chairman of Multibeam, sat down with Semiconductor Engineering to talk about how next-gen lithography tools can be used to prevent cyber attacks and counterfeiting of hardware.
Ed Sperling, Semiconductor Engineering



June 2016
GSA Forum: Reducing IC Manufacturing Cost While Enhancing IoT Security

For IoT devices, CEBL offers a timely solution for rapid prototyping at low cost while preventing counterfeiting and hacking with chip-specific security data embedded in the device.
GSA Forum



November 2015
Semiconductor Engineering interview of David K Lam: Inside Multibeam E-beam Lithography
One-on-one: Dr. Lam sounds off on next-generation lithography and how to solve some very difficult problems.
Semiconductor Engineering sat down with David K Lam, chairman of Multibeam, a developer of multi-beam e-beam tools for direct-write lithography applications. Lam is also a venture capitalist. He founded Lam Research in 1980, but left as an employee in 1985. What follows are excerpts of that conversation.
Mark LaPedus, Semiconductor Engineering



November 2015
Multibeam Opens New Headquarters

Multibeam's new facility has more office and cleanroom space. The address is:
3951 Burton Dr. Santa Clara, CA 95054, U.S.A.


May 2015
eBeam Initiative Interview

Perspectives - Dr. Lam, Multibeam Corporation - Summer Edition 2015
Watch the video...


April 2015
Multibeam Secures Two Patents Encompassing Multicolumn E-Beam Inspection

Multibeam Corporation, a leading developer of Complementary E-Beam Lithography (CEBL) systems, today confirmed that it was issued two patents by the USPTO last week. The new patents collectively integrate process control that encompasses the rapid inspection and reduction of small physical defects.


June 2014
From The Whiteboard: David K Lam

A look at what’s missing in semiconductor lithography and what’s needed to finish the job.
Semiconductor Engineering
Watch video...


January 2014
Waiting For Next-Generation Lithography

The semiconductor industry has several possible replacements for 193nm immersion, but timing and commercial viability are still in question.
Semiconductor Engineering


October 2013
Getting Direct on Litho

One-on-one with David Lam about next-generation lithography, where he's placing his bets, and what's changing in the VCl world.


July 2013
Slideshow: Lam Eyes Next $1B Opportunity

SANTA CLARA, Calif. -- At 70, David K. Lam is as excited as ever about the future of the semiconductor industry and what he says is his billion-dollar opportunity to nudge it forward for the second time.
EE Times


April  2013
Dr. David K. Lam featured in "Experiencing Silicon Vally" memoir by Tom Rigoli

TAP Times - Volume 4, Number 4 - April 2013 - Page 40


March 2013
Another Key Patent Issued to Multibeam

Multibeam Corporation announces the addition of another key patent to its IP portfolio. The U.S. Patent and Trademark Office has granted US Patent #8,384,048 B2 to Multibeam Corporation.


February 2013
David K. Lam Honored at Engineer’s Week Banquet
Dr. David K. Lam and three other eminent technologists were honored last night at the Engineer’s Week Banquet by being inducted into the Silicon Valley Engineering Hall of Fame.


January 2013
2013 SPIE Advanced Lithography is Playing Host to Industry-veteran Dr. David K Lam

Multibeam Corporation today confirmed that it will participate in SPIE Advanced Lithography 2013 in San Jose, CA, the world renowned symposium on semiconductor lithography and inspection/metrology.


November 2012
Technology Entrepreneur David K. Lam Named to Silicon Valley Engineering Hall of Fame

Dr. David K. Lam, widely known as the founder of Lam Research Corporation in 1980, and currently chairman of both Multibeam Corporation and the David Lam Group, has been selected for induction into the distinguished Silicon Valley Engineering Hall of Fame.

October 2012
Multibeam Corporation Announced the Addition of Another Key Patent to its Portfolio
The U.S. Patent and Trademark Office has granted US Patent # 8,242,457 B2 to Multibeam Corporation. This invention relates to the field of charged particle optics, and in particular to systems for generating high current density shaped electron beam.
July 2012
Lithography Landscape: E-Beam Lithography Revisited. By Dr. David K. Lam, Multibeam Corporation

We think you'll enjoy this article published by Future Fab International, written by Dr. David K Lam.
February 2012
Dr. David K. Lam Talks at 2012 SPIE Advanced Lithography

Tuesday February 14, 2012
San Jose Convention Center

Ballroom J2 - 9:40AM
2012 SPIE Advanced Lithography is playing host to industry-veteran Dr. David K Lam.
February 2012
Dr. David K. Lam will present at SPIE Advanced Lithography 2012

12 - 16 February 2012
San Jose Convention Center and San Jose Marriott
San Jose, California, USA
At SPIE Advanced Lithography 2012, Dr. David K. Lam will present Multiple column high-throughput e-beam inspection.

January 2012
Multibeam Corporation is a Winner of the Red Herring's 2011 Top 100 Global Award

Santa Clara, California - January 3, 2012 - multibeam Corporation announced that it has been selected as a Winner of the Red Herring's 2011 Top 100 Global award, a prestigious recognition honoring the year's most audacious and far reaching private technology companies and entrepreneurs from across the globe.
December 2011
Multibeam Corporation Selected as a Finalist for Red Herring Global Award

December 5, 2011 - Multibeam Corporation announced that it has been selected as a candidate for Red Herring's 2011 Top 100 Global award, a prestigious recognition honoring the year's most audacious and far reaching private technology companies and entrepreneurs from across the globe.

September 2011
E-beam Lithography Precision at Optical Lithography Speed: Complementary Lithography Breaks the NGL Logjam
September 6, 2011 - What is semiconductor lithography’s current state? Cost is rising, debate is raging, and a solution is wanting.

July 2011
Solid State Technology Published Today the Column Article Written by David K Lam

The column summarizes Lam's invited talk on Extending Optical Lithography with CEBL (Complementary E-Beam Lithography), scheduled for Wednesday, July 13, at noon, at the Advanced Lithography TechXPOT.



June 2011
Multibeam Corporation Selected as a Red Herring Top 100 North America Tech Startup

Red Herring announced that it has selected Multibeam Corporation as a Winner of the Top 100 North America award, a prestigious list honoring the year's most promising private technology ventures from the North American business region.



May 2011
SEM Substrates Inspection with Multiple Electron Beam Technology

Santa Clara, CA - Multibeam Corporation announced the addition of another key patent to its portfolio. The U.S. Patent and Trademark Office granted US Patent # 7,941,237 to Multibeam Corporation on May 10, 2011. The patent covers a method to inspect substrates with multiple e-beam columns.


April 2011
Another Key Patent Granted to Multibeam Corporation
Santa Clara, CA – The U.S. Patent and Trademark Office granted Multibeam Corporation another key patent. US Patent #7,928,404 was issued to Multibeam on April 19, 2011. The patent covers a method to blank and unblank an electron beam with high speed and low blur, enabling faster and more precise Electron-Beam Lithography (EBL).


April 2011
Multibeam Corporation's Technical Papers in the 2011 Proceedings of the Advanced Lithography Symposium
Santa Clara, CA – SPIE published two technical papers by Multibeam Corporation in the 2011 Proceedings of the Advanced Lithography Symposium. These papers follow a series of presentations on E-Beam Lithography (EBL) in the United States and Japan, by Multibeam.

March 2011
New details on Complementary Electron-Beam Lithography (CEBL)
Solid State Technology
Santa Clara, CA – Solid State Technology (SST) is revealing new details on Complementary Electron-Beam Lithography (CEBL). CEBL was introduced by Multibeam Corporation at the SPIE Advanced Lithography Symposium earlier this month.


March 2011
Complementary Electron-beam Lithography Extends Optical Litho Life

Solid State Technology
At SPIE Advanced Lithography (2/27-3/3/11, San Jose, CA), David K Lam, chairman of Multibeam Corp., and the founder and former CEO of Lam Research, presented the concept of complementary e-beam lithography (CEBL).


March 2011
A Glimpse into Intel’s Litho Future
Solid State Technology

March 7, 2011 - If anything in the litho world is certain, it's that 193nm ArF immersion lithography (193i) is being extended..

February 2011
EE Times Interview with David K. Lam
EE Times
Santa Clara, CA – EE Times published today an interview with David K. Lam, Chairman of Multibeam Corporation.
The article introduces Multibeam’s Complementary Electron-Beam Lithography (CEBL), which enables cost-effective production of microchips at upcoming technology generations.

Trade Publications

For thirty years, EE Times has been the electronics industry newspaper.

Semiconductor Magazine covers semiconductor manufacturing, industry news, semiconductor equipment, and more.

Industry Organizations

Multibeam is a SEMI member. SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display, and photovoltaic industries.

SPIE is an international society advancing an interdisciplinary approach to the science and application of light.



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